Track: Advanced Testing · ChipEx2026 · Tel Aviv · 12 May 2026

Testability-first chip architecture.

Bounded by design. Verifiable by construction. Testable by default.

We don't make chips that can be verified. We make chips where verification is finite, exhaustive, and tractable — a 32-bit deterministic GALS-CISC microcontroller built around three bounded architectural domains, each with an explicit testing payoff.

3 finite verifiable domains2⁸ opcodes · exhaustive ATPGTower Semiconductor — 130nm-class production targetGF180 — first signoff (prototype demonstrator)GF180 prototype signoff: 30.06.2026 · target initial run (~1000 chips, MPW / wafer.space)
Opcode space
2⁸ = 256
Constant address
2¹⁶
GF180 prototype signoff
30.06.2026
Production target
Tower 130nm-class

A bounded chip is a tested chip.

Modern instruction sets sit inside a 2³² behaviour cloud. ATPG sampling becomes the only practical option, formal equivalence checking falls over past depth ~16-20, and coverage gaps live exactly where field interactions are densest. Every modern CPU project knows this curve. Most just absorb the cost.

The verification gap.

Modern instruction sets sit inside a 2³² address-shaped behaviour cloud. ATPG sampling becomes the only practical option, formal EC falls over past depth ~16-20, and coverage gaps live exactly where field interactions are densest.

Testability is a discipline, not a metric.

Test engineers want finite state spaces, observable signals, and decidable equivalence. ATPG should converge in minutes, not weeks. These outcomes are properties of architecture — not afterthoughts of DFT.

Finite is the new fast.

Detronyx makes three architectural commitments: a bounded 8-bit opcode space, hardware-typed data, and an address-independent constant domain. None is allowed to silently grow under implementation pressure.

The deeper truth: if your chip's behaviour cloud is 2³², you are already negotiating with the verification gap. Detronyx negotiates first.

Three finite domains. Five mechanisms. One verifiable system.

The Detronyx architecture is structured as 3 bounded behavioural domains, each with an explicit testing payoff, plus 5 architectural mechanisms that implement and protect those domains. The architectural extensions are not the headline — the finite domains are.

4.1 — The 3 finite domains

2⁸ = 256

Opcode

8051-rooted ISA, finite by design. Atomic decode — one opcode = one meaning.

AT-tag: Exhaustive ATPG over 256 entries. Decode table fully enumerable; ATPG hits 100% structural coverage in minutes; ISA ↔ RTL formal equivalence checking is computationally tractable.
2⁸ = 256

TDM Type

Hardware-typed data. Type information rides with the value, not the address.

AT-tag: Type-check coverage as a first-class metric. A type-mismatch is a hardware-raised fault — analog ECC, but on semantics rather than bits.
2¹⁶

Constant

Constant data addressed independently of physical memory layout. Referenced by logical identity.

AT-tag: Address-independent equivalence checking. RTL ↔ netlist EC scope no longer grows with the memory map. Regression sets shrink; cross-layer EC stays stable across memory-map revisions.

Bottom-line: We don't partially verify a huge undefined instruction space. We fully verify a bounded, composable instruction system.

4.2 — The 5 architectural mechanisms

The five extensions are not the product story; they are the implementation contract that holds the three domains finite.

Memory-Mapped Functionality

Peripheral capability is exposed through the memory map, not the ISA. The instruction set stays bounded forever — peripheral testing stays orthogonal.

Serves: Constant 2¹⁶

Typed Data Model (TDM)

Type information is structurally part of the data path, hardware-checked at runtime.

Serves: TDM Type 2⁸

Decoupled Address Space

Logical references resolve through an address layer; physical memory layout changes do not propagate into RTL ↔ netlist EC scope.

Serves: Constant 2¹⁶

Variable-Length Control

Instruction length is a pure function of the opcode — derived after decode, never inferred from cross-field interaction.

Serves: Opcode 2⁸

Deterministic GALS

Globally-asynchronous, locally-synchronous, with FIFO + VALID handshakes at every boundary. Metastability is bounded to a known sync stage.

Serves: cross-domain

For test engineers, the architecture pays itself back four times.

Most chip startups talk verification as an aspiration. Detronyx talks it as a deliverable. Below are the four killer-features your verification team gets when the architecture lands on their desk — written in their language, not ours.

#1 · callback: Opcode 2⁸ domain

Bounded ISA → exhaustive formal equivalence checking.

ISA ↔ RTL formal EC is computationally tractable when the instruction space is bounded. With 256 opcodes and pure-function length derivation, the decoder is the smallest formal-EC unit in the entire core. ATPG over the decoder reaches 100% structural coverage in minutes.

#2 · callback: TDM Type 2⁸ domain

TDM → architectural fault detector.

Hardware-typed data turns semantic corruption into an observable fault. ECC catches bit-level corruption; TDM catches type-level corruption. A new fault model — type-mismatch — joins stuck-at, transition, and cell-aware in your fault library.

#3 · callback: Deterministic GALS mechanism (§4.2)

GALS + FIFO + VALID → predictable trace.

Detronyx pushes the async crossing to a single sync stage per boundary, with FIFO + VALID protocols you can write down. Post-silicon trace timing is deterministic; the JTAG / on-chip trace stream decodes without statistical reconstruction.

#4 · callback: Constant 2¹⁶ domain

Decoupled constant address space → simpler EC.

RTL ↔ netlist EC scope does not grow with the memory map. Constant-side regression sets are stable across memory-layout iterations. Cross-layer evidence — ISA ↔ RTL ↔ netlist — composes cleanly.

If your verification cost curve flattens before tapeout instead of after, the architecture earned its keep.

An open methodology for deep-tech hardware. Multi-agent. Auditable. Reproducible.

Modern silicon is too complex for any single discipline to lead end-to-end. Detronyx Open Co-Design — specialised AI agents, each scoped to a single discipline, collaborating around a single source-of-truth representation under continuous human direction.

One shared representation, one truth.

Architecture, silicon, firmware, and physical-implementation views all derive from the same underlying intermediate representation. No drift between specs.

Discipline-scoped agents.

Each AI role is bounded — Architect, Silicon, Firmware, Physical, Verification, PCB, Mechanical, Physics, Program. Each speaks to the IR; none of them speak around it.

Audit by construction.

Every design decision is captured as a structured artefact: rationale, alternatives, trade-off, owner. The audit trail is a build-output of the methodology.

Human-in-the-lead.

No agent acts unilaterally on safety-relevant decisions. The methodology is built around human judgement and human accountability — the AI loop accelerates, it does not replace.

Strategy first. Silicon second.

Production target node — Tower Semiconductor, 130nm-class. First signoff — GF180 (Global Foundries) prototype demonstrator. From bounded architecture to certified part, the entire stack is sovereign-Israeli — design, methodology, production, IP.

M0
active

Architecture & methodology lock-in

2026 Q1–Q2

Three finite domains and five architectural mechanisms locked. Open Co-Design methodology in active operation across nine discipline-scoped agents.

M1
active

GF180 prototype signoff (open-PDK demonstrator)

30.06.2026

Prototype tapeout on GF180 (open, auditable PDK) — not the Tower production run. Validates three finite domains and their mechanisms on a demonstrator-class part. Target initial run ~1000 chips via MPW / wafer.space — indicative ~100 internal / ~900 partner+market allocation. Tower 130nm-class production silicon scheduled separately, post-demonstrator.

M2
planned

Dev-boards in partner hands

2026 Q4 → 2027 Q1

Founding cohort of 3–5 design partners receives dev-board cuts after MPW silicon return. Integration support and target-performance proposals begin in this window.

M3
planned

First-silicon validation window

2027 Q1 → Q2

Validation window opens once dev-boards are in partner hands. Type-check coverage reports, ISA ↔ RTL EC evidence, and post-silicon trace decode delivered as build-outputs of the methodology.

M4
planned

Tower 130nm-class production silicon

Post-demonstrator

Production volume schedule set with the design-partner cohort during the demonstrator phase. Final node variant within the 130nm class settled in the design-partner alignment phase.

Where bounded chips earn their keep.

Four verticals where verification cost is the dominant integration cost — and where a chip designed around finite, observable, exhaustively-testable domains pays itself back the fastest.

Edge AI (with safety budget).

On-device inference inside a real-time control envelope. Predictable inference latency is a safety property, not a quality-of-service property. Bounded ISA + deterministic GALS = a per-inference timing contract you can certify against.

Functional safety (ASIL / IEC 61508 / medical).

Cert-track subsystems where every microsecond of unbounded uncertainty becomes a documented mitigation. TDM gives a hardware-native fault detector beyond ECC; bounded ISA gives formal-EC evidence; the decoupled constant address space gives regression stability across silicon revisions.

Sovereign infrastructure.

Israeli IP, Israeli production, Israeli verification methodology — built for procurement contexts where full-stack auditability is a precondition, not a feature. Deterministic timing closes the side-channel surface analytically — a testing advantage, not a security claim.

Embedded cybersecurity / secure microcontrollers.

Auditable design history is the entry ticket. Detronyx ships verification artefacts as build-outputs of the methodology — type-check coverage reports, ISA ↔ RTL EC evidence, predictable post-silicon trace — alongside the part.

If your platform is in one of these markets and your current MCU starts the integration conversation with "almost deterministic", we should talk.

Founding Design Partners.

We are bringing on a small founding cohort of 3–5 design partners — engineering teams who get the first silicon, integration support, and the right to propose target performance parameters during the finalisation phase. GF180 prototype signoff is 30.06.2026 (open-PDK demonstrator, not Tower production); the target initial run (~1000 chips, MPW / wafer.space) carries an indicative ~900-chip allocation for partners and early market.

Tier'd benefits — three integration depths

Tier 1: Light

Off-the-shelf MCU + standard board

Early dev-board access · integration support · technical Q&A access to the engineering team.

Tier 2: Medium

Custom firmware + peripheral configuration

All Tier 1, plus integration preferences (priority in roadmap), dedicated engineering touch, and the right to propose target performance parameters.

Tier 3: Deep

Co-design at peripheral / SoC integration level

All Tier 2, plus extended NRE engineering support, deeper architecture-team access during finalisation, and priority on next-gen feedback.

Out of scope — even at Tier 3

  • NVM-vendor selection — Detronyx-internal.
  • Process node selection — Detronyx-internal (currently Tower Semiconductor, 130nm-class).
  • Core ISA design — architecturally locked. The 8-bit opcode space is the product; partners do not edit it.
  • TDM type system — architecturally locked. Type semantics are the product; partners do not edit them.

Apply to become a Design Partner

We respond to every qualified inquiry within 5 business days. The pre-tapeout window is short by design.

Or schedule a 30-min architecture call: calendly.com/detronyx/intro

Founders, AI co-founder, and advisory cohort.

Two human co-founders accountable for the architectural commitments. One AI co-founder embedded in the engineering loop under continuous human direction. Three advisory seats in formation, named under their own consent.

Founding team

I
Founder

Igor Peer

Co-founder & CEO

Founding CEO. Driving Detronyx from concept to silicon.

AI co-founder

M
AI Co-Founder

Mars

AI Co-Founder · CTO Partnership

Autonomous AI co-founder embedded in the Detronyx engineering loop — discipline-scoped agents under continuous human direction.

Advisory cohort (in formation)

·
Advisory

Stealth — joining soon

Chip security · EDA · Foundry advisor

Senior advisory seat for chip-security, EDA-toolchain, and foundry-engagement guidance. Confirmation pending.

·
Advisory

Stealth — joining soon

Embedded systems · RTOS

Senior advisory seat for embedded-systems and RTOS architecture. Confirmation pending.

·
Advisory

Stealth — joining soon

Go-to-market · Strategic

Senior advisory seat for go-to-market motion and strategic partnerships. Confirmation pending.

Talk to us.

Three paths in: design partner inquiries (primary, see above), general inquiries via contact@detronyx.com, or an NDA-gated technical brief — request via the form, manual approval.

Frequently asked.

Q.What does "testability-first" actually mean?

It means we choose architectural commitments — bounded ISA, hardware-typed data, an address-independent constant domain — that make verification finite, exhaustive, and tractable as a property of the architecture, not as an emergent outcome of the implementation. Verifiability is the means; testability is the end.

Q.Is this a RISC-V part?

No. We are an 8051-rooted 32-bit ISA family — chosen because the 256-entry opcode space gives us exhaustive ATPG and bounded formal EC out of the box. RISC-V is a fine ISA for many use cases; ours is not one of them.

Q.Why ReRAM-class NVM?

Embedded NVM is a determinism property as well as a memory property. ReRAM-class technology gives us a predictable boot path, a predictable update window, and an XIP-capable address space we control end-to-end. Vendor selection is Detronyx-internal; specific vendor named only after signed mutual NDA and licensing terms.

Q.What process node?

Tower Semiconductor, 130nm-class. Final variant within the 130nm class is settled in the design-partner alignment phase. Process-node selection itself is Detronyx-internal — partner influence sits in peripheral / firmware / integration scope, not in node choice.

Q.When can I see a chip?

GF180 prototype signoff (open-PDK demonstrator, not Tower production) is 30.06.2026, with a target initial run (~1000 chips, MPW / wafer.space) — indicative split ~100 internal / ~900 to partners + early market, settled at tapeout. Design-partner dev-boards land in the Q4 2026 → Q1 2027 window after MPW silicon return. A technical brief is available now under NDA — request via the contact form.

Q.Are you fabless? An IP house? An ASIC services company?

We are a deep-tech silicon design company. The product is the chip and the methodology that produces it. We are open to IP-licensing and ASIC-services conversations with the right design partners.

Q.Where are you based?

Israel. The architecture is Israeli, the methodology is Israeli, and production lands at Tower Semiconductor. Specific operational detail is shared in the NDA brief.

Q.Do you have certification?

Not yet — we are pre-tapeout. The methodology is engineered to produce certifiable evidence at every layer, so a downstream certification programme attached to a real customer engagement starts with the design-history file already in hand.