Agents-as-a-Service

You bring the task. We bring everything else.

AI agents that compress chip development cycles and smooth your transition to deterministic silicon.

Hand us the task — we close the loop end-to-end. Two value props, both measurable: (a) we collapse development time — faster time-to-device, faster bring-up, fewer hand-off stalls between silicon, board, firmware, and enclosure surfaces; (b) we make the transition painless — whether you are migrating a legacy MCS-51 / 8051 codebase forward to 8051E, or adopting deterministic silicon for the first time, the lift onto our methodology is engineered to be smooth, not heroic.

What we deliver

Three discipline pillars. We close the gap so your team keeps moving.

You bring the task; the agents draft, your engineers approve, the audit trail writes itself. Each pillar is a bounded contract — what the agents see in your IR, what they produce, what they must escalate. The output is engineering deliverables your hardware team can sign off, not a chat transcript.

Firmware

Discipline-scoped firmware agents draft the embedded code your chip needs. SDK scaffolding, RTOS port, scheduler proofs, secure-boot / OTA infra — all tracked against the IR your hardware team already authors.

8051E SDK, board-support packages, peripheral drivers
RTOS bring-up (FreeRTOS / Zephyr-class), deterministic scheduler proofs
Secure boot, root-of-trust, signed-firmware update path
OTA update infrastructure with rollback guarantees
Trace-decode tooling delivered alongside the firmware tree
Continuous spec ↔ firmware equivalence checks against the IR

Case study coming →

Board / PCB

PCB-discipline agents execute schematic review, layout iteration, and SI/EMC sweeps under a single shared IR. Your hardware engineers stay in the lead — agents draft, humans approve, the audit trail writes itself.

Schematic capture and BOM management — output translated to your team's EDA (Synopsys, Cadence, Siemens, Altium, in-house)
Multilayer PCB layout (4–8 layers typical, more on request)
Signal-integrity and EMC pre-compliance analysis
Power-tree design, decoupling, and thermal budgeting
Sensor / peripheral integration and bring-up dev-kits
Manufacturing DfM review and test-jig artefacts

Case study coming →

3D / Mechanical

Mechanical agents own enclosure CAD, thermal sim, and vibration analysis under the same IR. Geometry decisions are recorded as structured artefacts; mechanical drift between revisions becomes a verifiable property.

Enclosure / housing 3D CAD (STEP, FreeCAD / Fusion exports)
Thermal simulation and dissipation budgeting
Vibration, drop, and mounting-stress analysis
Mechanical assembly drawings and tolerancing
Connector / cable routing and EMI shielding plan
DfM review for enclosure injection-molding or sheet-metal

Case study coming →

Shared state layer

One state, every domain.

The three pillars are not independent silos. Our agents share a single source of truth across firmware, board layout, and 3D mechanics — a unified design container — and co-optimize across them, not in isolation. A pin-budget shift on the board re-plans firmware drivers and re-checks enclosure cut-outs in the same IR transaction. This is the core of the co-design protocol: cross-domain optimization, not three teams negotiating over email.

How agents collaborate with engineers

Agents draft. Humans decide. The IR keeps everyone honest.

Bounded autonomy.

Agents act within their role contract. Cross-domain coupling goes through the IR, not through the agents. No agent acts unilaterally on safety-relevant decisions.

Audit-by-construction.

Every agent decision is captured as a structured artefact: rationale, alternatives, trade-off, owner. The audit trail is the build-output of the methodology — your design history file is already in hand the day silicon arrives.

Continuous EC.

Every silicon-side change runs against the IR-derived spec; every spec evolution propagates back through formal EC. Verification scaffolding is baked into the design loop, not bolted on after.

Human escalation rails.

Agents flag, humans decide. Safety-relevant choices, IP-licensing implications, and any decision affecting the three finite domains route to a human owner with a structured decision artefact attached.

Reference: 8051E build

Running the protocol on our own silicon.

The 8051E ISA evolution — three finite domains, five mechanisms, 17 new ops across MOVX_IRAM, ATOMIC_BIT, AUTH, UPDATE, SYSTEM_MANAGEMENT — is the first chip programme being built under the Open Co-Design Protocol. Firmware, board, and mechanical work for the GF180 demonstrator are being executed under the agents service. First signoff: 30.06.2026. The agents are not a side-project; they are the engineering capability.

8051E ISA whitepaper → Open Co-Design Protocol

Engagement

Skip the staffing wait. Ship faster.

Hand us the task — we compress the cycle and smooth the migration onto deterministic silicon. Onboarded as Tier 2 / Tier 3 design-partner engagements: the agents are the engineering capability we bring; your team owns the design.

Become a Design Partner Agent service inquiry